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Mil-P-81728 Tin Lead

IL-P-81728A, MILITARY SPECIFICATION: PLATING, TIN LEAD (ELECTRODEPOSITED) (13 FEB 1973) [S/S BY SAE-AMS-P-81728]., This specification covers the requirements for electrodeposited tin-lead plating.

 Either a satin or bright luster is acceptable. Has excellent solder-ability. 0.0002" copper plate generally required on copper base alloys. No undercoating required on steel substrates unless otherwise specified.

Typical specified thickness: .0002"-.0008"

Download Mil-P-81728 Specification

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